Personal profile
ShortBio
Nuria Quintano Fernández is a member of the Software Lifecycle Innovation team at TECNALIA. Six Sigma Postgraduate, MBA and Bachelore’s degree in Computer Science. More than twenty years experience in R&D projects and technology transfer projects to the ICT sector. She has participated in five international research projects, more than fifty contracts with private companies and more than ten public funded R&D projects. Her research interest, knowledge and expertise is on innovating the trustworthy software development lifecycle in business critical contexts for better business performance. Key research areas under this context are: trustworthiness by design, artificial intelligence techniques to improve trustworthy software development lifecycle performance, quantitative governance of the trustworthy software development lifecycle performance, successful combination of people, process, technology and data in trustworthy software development businesses.
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Collaborations and top research areas from the last five years
Research output
- 3 Conference contribution
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Ensuring Trustworthiness of Hybrid AI-Based Robotics Systems
Eguia, A., Quintano, N., Marsh, I., Barreteau, M., Główka, J. & Sprońska, A., 2024, European Robotics Forum 2024 - 15th ERF. Secchi, C. & Marconi, L. (eds.). Springer Nature, p. 142-146 5 p. (Springer Proceedings in Advanced Robotics; vol. 33 SPAR).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Towards measuring the aggregated debt of Trustworthiness level
Urretavizcaya, I., Quintano, N. & Martinez, J., 16 Aug 2024, Proceedings - International Conference on Technical Debt 2022, TechDebt 2022. Institute of Electrical and Electronics Engineers Inc., p. 56-60 5 p. (Proceedings - International Conference on Technical Debt 2022, TechDebt 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Security Debt: Characteristics, Product Life-Cycle Integration and Items
Martinez, J., Quintano, N., Ruiz, A., Santamaria, I., De Soria, I. M. & Arias, J., May 2021, Proceedings - 2021 IEEE/ACM International Conference on Technical Debt, TechDebt 2021. Institute of Electrical and Electronics Engineers Inc., p. 1-5 5 p. (Proceedings - 2021 IEEE/ACM International Conference on Technical Debt, TechDebt 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
4 Citations (Scopus)