Advanced packaging for GaN high power electronics

J. Marcos^*
, I. Cobo
, J. Barcena
, J. Maudes
, R. Amado
, M. Vellvehi
, X. Jorda
, I. Obieta
, C. Guraya
, L. Bilbao
, C. Jiménez
, J. Coleto

^*Corresponding author for this work

Foundation TECNALIA Research & Innovation
CNM

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Sort by

Engineering

Material Science