TY - GEN
T1 - Advancement of Multifunctional support structure technologies (AMFSST)
AU - John, R.
AU - Atxaga, G.
AU - Frerker, H. J.
AU - Newerla, A.
PY - 2007
Y1 - 2007
N2 - The multifunctional support structure (MFSS) technology is promising a reduction of overall mass and packing volume for spacecraft (S/C) electronic components. This technology eliminates the electronic box chassis and the cabling between the boxes by integrating the electronics, thermal control and the structural support into one single element. The ultimate goal of the MFSS technology is to reduce size, weight, power consumption, cost and production time for future spacecraft components. The paper focus on the main challenges and solutions related to the thermal management within the MFSS technology based on the selected charge regulator (CR) application. Starting with the main set of thermal requirements for the CR the paper will include: Conceptual and detailed design based on high-conductivity carbon fibre CFRP, Description and results of the thermal material sample test program, Parameter and results for the performed first thermal simulation
AB - The multifunctional support structure (MFSS) technology is promising a reduction of overall mass and packing volume for spacecraft (S/C) electronic components. This technology eliminates the electronic box chassis and the cabling between the boxes by integrating the electronics, thermal control and the structural support into one single element. The ultimate goal of the MFSS technology is to reduce size, weight, power consumption, cost and production time for future spacecraft components. The paper focus on the main challenges and solutions related to the thermal management within the MFSS technology based on the selected charge regulator (CR) application. Starting with the main set of thermal requirements for the CR the paper will include: Conceptual and detailed design based on high-conductivity carbon fibre CFRP, Description and results of the thermal material sample test program, Parameter and results for the performed first thermal simulation
UR - http://www.scopus.com/inward/record.url?scp=48049085003&partnerID=8YFLogxK
U2 - 10.1109/THERMINIC.2007.4451755
DO - 10.1109/THERMINIC.2007.4451755
M3 - Conference contribution
AN - SCOPUS:48049085003
SN - 9782355000027
T3 - Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC
SP - 98
EP - 103
BT - Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007
T2 - 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC 2007
Y2 - 17 September 2007 through 19 September 2007
ER -