Comparison and evaluation of sub-module configurations in modular multilevel converters

Georgios Konstantinou, Jiaqi Zhang, Salvador Ceballos, Josep Pou, Vassilios G. Agelidis

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

61 Citations (Scopus)

Abstract

The application and research interest over modular multilevel converters (MMCs) has grown significantly over the last couple of years. The term MMC has been expanded to include all converters built on the series connection of sub-modules (SMs) as a basic building block forming converter arms and phase-legs. A review of the current literature reveals an abundance of SM configurations ranging from SMs derived from the well-known multilevel converter topologies to novel configurations targeted to niche MMC applications. This paper provides a comprehensive review of the current SM configuration state and a comparative evaluation based on complexity of configuration, voltage balancing and component count. It also provides an evaluation of switching and conduction losses for the devices within each SM, identifying those SMs that are more suitable to general MMC applications.

Original languageEnglish
Title of host publication2015 IEEE 11th International Conference on Power Electronics and Drive Systems, PEDS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages958-963
Number of pages6
ISBN (Electronic)9781479944033
DOIs
Publication statusPublished - 14 Aug 2015
Event11th IEEE International Conference on Power Electronics and Drive Systems, PEDS 2015 - Sydney, Australia
Duration: 9 Jun 201512 Jun 2015

Publication series

NameProceedings of the International Conference on Power Electronics and Drive Systems
Volume2015-August

Conference

Conference11th IEEE International Conference on Power Electronics and Drive Systems, PEDS 2015
Country/TerritoryAustralia
CitySydney
Period9/06/1512/06/15

Keywords

  • Multilevel converters
  • modular multilevel converter (MMC)
  • submodules
  • voltage balancing

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