@inproceedings{2699105f6dfc419a9cc777067e687887,
title = "Enabling patterning of polymer optical devices working at visible wavelength using thermal nano-imprint lithography",
abstract = "Thermal Ultraviolet NanoImprint Lithography is a fast and reliable process to manufacture large scale integrated polymer-based optical components from a soft stamp. This technology already provides polymer integrated components for optical communications operating in the infrared region. However, several fabrication issues must be addressed to enable reliable mass production of optical components working in the visible region, especially when patterning large devices with nanometric features. In this work, we report our fabrication results on grating coupler and optical microring resonators with SU-8 resist. The device is conceived for monomode visible wavelength operation dedicated to future optical sensing applications. For this purpose, sub-micron waveguides are needed. We reported two main defects on soft stamp fabrication: Partial sidewall detachment and shifted or double embossing of the features. Nanoimprinting SU-8 waveguides was achieved with the operational devices of the soft stamp.",
author = "{Diez Garcia}, Miguel and Vincent Raimbault and Simon Joly and Laurent Oyhenart and Leire Bilbao and Nguyen, {Chi Thanh} and Isabelle Ledoux-Rak and Laurent Bechou and Isabel Obieta and Corinne Dejous",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 ; Conference date: 29-05-2017 Through 01-06-2017",
year = "2017",
month = jul,
day = "18",
doi = "10.1109/DTIP.2017.7984456",
language = "English",
series = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Benoit Charlot and Pascal Nouet and Claude Pellet and Yoshio Mita and Francis Pressecq and Peter Schneider and Stewart Smith",
booktitle = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017",
address = "United States",
}