Enabling patterning of polymer optical devices working at visible wavelength using thermal nano-imprint lithography

Miguel Diez Garcia, Vincent Raimbault, Simon Joly, Laurent Oyhenart, Leire Bilbao, Chi Thanh Nguyen, Isabelle Ledoux-Rak, Laurent Bechou, Isabel Obieta, Corinne Dejous

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

Thermal Ultraviolet NanoImprint Lithography is a fast and reliable process to manufacture large scale integrated polymer-based optical components from a soft stamp. This technology already provides polymer integrated components for optical communications operating in the infrared region. However, several fabrication issues must be addressed to enable reliable mass production of optical components working in the visible region, especially when patterning large devices with nanometric features. In this work, we report our fabrication results on grating coupler and optical microring resonators with SU-8 resist. The device is conceived for monomode visible wavelength operation dedicated to future optical sensing applications. For this purpose, sub-micron waveguides are needed. We reported two main defects on soft stamp fabrication: Partial sidewall detachment and shifted or double embossing of the features. Nanoimprinting SU-8 waveguides was achieved with the operational devices of the soft stamp.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017
EditorsBenoit Charlot, Pascal Nouet, Claude Pellet, Yoshio Mita, Francis Pressecq, Peter Schneider, Stewart Smith
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538629529
DOIs
Publication statusPublished - 18 Jul 2017
Event19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 - Bordeaux, France
Duration: 29 May 20171 Jun 2017

Publication series

NameSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017

Conference

Conference19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017
Country/TerritoryFrance
CityBordeaux
Period29/05/171/06/17

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