From materials to devices: Bottom-up integration of nanomaterials onto silicon microstructures for thermoelectric and piezoelectric applications

  • Luis Fonseca
  • , Carlos Calaza
  • , Marc Salleras
  • , Gonzalo Murillo
  • , Jaume Esteve
  • , Albert Tarancon
  • , Alex Morata
  • , Jose D. Santos
  • , Gerard Gadea

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

Energy autonomy keeps being one of the most desired enabling functionalities in the context of off-grid applications, such as continuous monitoring scenarios and distributed intelligence paradigms (Internet of Things, Trillion Sensors). SiNERGY, a European project (GA n° 604169) coordinated by IMB-CNM (CSIC) has focused on silicon and silicon friendly materials and technologies to explore energy harvesting and storage concepts for powering microsensors nodes. Harvesting energy, tapping into environmentally available sources may be a good solution to overcome the use of primary batteries. 10-100 microwatts per square centimeter power densities seem appropriate for many such applications. Specific thermoelectric and piezoelectric developments are reviewed.

Original languageEnglish
Title of host publication2017 Spanish Conference on Electron Devices, CDE 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509050727
DOIs
Publication statusPublished - 19 Apr 2017
Externally publishedYes
Event2017 Spanish Conference on Electron Devices, CDE 2017 - Barcelona, Spain
Duration: 8 Feb 201710 Feb 2017

Publication series

Name2017 Spanish Conference on Electron Devices, CDE 2017

Conference

Conference2017 Spanish Conference on Electron Devices, CDE 2017
Country/TerritorySpain
CityBarcelona
Period8/02/1710/02/17

Keywords

  • energy harvesting
  • micro-nanotechnology
  • piezoelectric material
  • silicon micromachining
  • thermoelectrics

Fingerprint

Dive into the research topics of 'From materials to devices: Bottom-up integration of nanomaterials onto silicon microstructures for thermoelectric and piezoelectric applications'. Together they form a unique fingerprint.

Cite this