Generative AI for Reengineering Variants into Software Product Lines: An Experience Report

Mathieu Acher, Jabier Martinez

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Citations (Scopus)

Abstract

The migration and reengineering of existing variants into a software product line (SPL) is an error-prone and time-consuming activity. Many extractive approaches have been proposed, spanning different activities from feature identification and naming to the synthesis of reusable artefacts. In this paper, we explore how large language model (LLM)-based assistants can support domain analysts and developers. We revisit four illustrative cases of the literature where the challenge is to migrate variants written in different formalism (UML class diagrams, Java, GraphML, statecharts). We systematically report on our experience with ChatGPT-4, describing our strategy to prompt LLMs and documenting positive aspects but also failures. We compare the use of LLMs with state-of-the-art approach, BUT4Reuse. While LLMs offer potential in assisting domain analysts and developers in transitioning software variants into SPLs, their intrinsic stochastic nature and restricted ability to manage large variants or complex structures necessitate a semiautomatic approach, complete with careful review, to counteract inaccuracies.

Original languageEnglish
Title of host publication27th ACM International Systems and Software Product Line Conference, SPLC 2023 - Proceedings
EditorsPaolo Arcaini, Maurice H. ter Beek, Gilles Perrouin, Iris Reinhartz-Berger, Ivan Machado, Silvia Regina Vergilio, Rick Rabiser, Tao Yue, Xavier Devroey, Monica Pinto, Hironori Washizaki
PublisherAssociation for Computing Machinery
Pages57-66
Number of pages10
ISBN (Electronic)9798400700927
DOIs
Publication statusPublished - 28 Aug 2023
Event27th ACM International Systems and Software Product Line Conference, SPLC 2023 - Tokyo, Japan
Duration: 28 Aug 20231 Sept 2023

Publication series

NameACM International Conference Proceeding Series
VolumeB-2

Conference

Conference27th ACM International Systems and Software Product Line Conference, SPLC 2023
Country/TerritoryJapan
CityTokyo
Period28/08/231/09/23

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