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Innovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applications
J. Barcena*, J. Maudes, M. Vellvehi, X. Jorda, I. Obieta, C. Guraya, L. Bilbao, C. Jiménez, C. Merveille, J. Coleto
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
22
Citations
(Scopus)