Innovative packaging solution for power and thermal management of wide-bandgap semiconductor devices in space applications

J. Barcena^*, C. Merveille, J. Maudes, M. Vellvehi, X. Jorda, I. Obieta, C. Guraya, L. Bilbao, C. Jiménez, J. Coleto

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Engineering

Material Science