TY - GEN
T1 - SPS Co-Sintering Of Metal-Ceramic Composites For High Performance Electronic Applications
AU - Lores, Asier
AU - Lagos, Miguel Angel
AU - Agote, Iñigo
AU - Leizaola, Iñaki
AU - Neubauer, Erich
AU - Kovacova, Zuzana
AU - Wallis, Christopher
AU - Bringer, Charlotte
N1 - Publisher Copyright:
© European Powder Metallurgy Association (EPMA)
PY - 2022
Y1 - 2022
N2 - Electronic packages and sensors for special purpose applications demands the use of high electrical resistivity ceramics and conductive metallic materials which are sometimes difficult to be compatibilized, and whose manufacturing process involves many different processing steps. In this study, a bi-material composite consisting on a resistive SiC-Feldspar ceramic with around 109Ω.cm and a conductive Invar36 alloy has been developed in a one-step process by Spark Plasma Sintering (SPS). The SPS process permits the fast co-sintering of the composite achieving near full densities. Also, it has been observed that the joining interface of the material is stable and crack free. Both selected ceramic and metallic materials have low and similar CTE values (3.5 ppm/K), which makes them ideal for co-processing purposes and also for applications where high dimensional stability is required.
AB - Electronic packages and sensors for special purpose applications demands the use of high electrical resistivity ceramics and conductive metallic materials which are sometimes difficult to be compatibilized, and whose manufacturing process involves many different processing steps. In this study, a bi-material composite consisting on a resistive SiC-Feldspar ceramic with around 109Ω.cm and a conductive Invar36 alloy has been developed in a one-step process by Spark Plasma Sintering (SPS). The SPS process permits the fast co-sintering of the composite achieving near full densities. Also, it has been observed that the joining interface of the material is stable and crack free. Both selected ceramic and metallic materials have low and similar CTE values (3.5 ppm/K), which makes them ideal for co-processing purposes and also for applications where high dimensional stability is required.
UR - http://www.scopus.com/inward/record.url?scp=85160764089&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85160764089
T3 - World PM 2022 Congress Proceedings
BT - World PM 2022 Congress Proceedings
PB - European Powder Metallurgy Association (EPMA)
T2 - World PM 2022 Congress and Exhibition
Y2 - 9 October 2022 through 13 October 2022
ER -
