Technical Debt Problems and Concerns

Jeffrey C. Carver, Xabier Larrucea, Alexander Serebrenik, Miroslaw Staron

Research output: Contribution to journalArticlepeer-review

Abstract

This article reports papers about technical debt (TD) from the 2021 IEEE/Association for Computing Machinery (ACM) International Conference on technical debt (TechDebt'21), the 43rd IEEE/ACM International Conference on Software Engineering: Journal First Track (ICSE-JF'21), the 43rd IEEE/ACM International Conference on Software Engineering: Software Engineering in Practice Track (ICSE-SEIP'21), and the 2021 IEEE/ACM 18th International Conference on Mining Software Repositories (MSR'21). Feedback or suggestions are welcome. In addition, if you try or adopt any of the practices included in the column, please send us and the authors a note about your experiences.

Original languageEnglish
Pages (from-to)116-119
Number of pages4
JournalIEEE Software
Volume39
Issue number3
DOIs
Publication statusPublished - 2022

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