Technical Debt Problems and Concerns

Jeffrey C. Carver, Xabier Larrucea, Alexander Serebrenik, Miroslaw Staron

    Research output: Contribution to journalArticlepeer-review

    Abstract

    This article reports papers about technical debt (TD) from the 2021 IEEE/Association for Computing Machinery (ACM) International Conference on technical debt (TechDebt'21), the 43rd IEEE/ACM International Conference on Software Engineering: Journal First Track (ICSE-JF'21), the 43rd IEEE/ACM International Conference on Software Engineering: Software Engineering in Practice Track (ICSE-SEIP'21), and the 2021 IEEE/ACM 18th International Conference on Mining Software Repositories (MSR'21). Feedback or suggestions are welcome. In addition, if you try or adopt any of the practices included in the column, please send us and the authors a note about your experiences.

    Original languageEnglish
    Pages (from-to)116-119
    Number of pages4
    JournalIEEE Software
    Volume39
    Issue number3
    DOIs
    Publication statusPublished - 2022

    Fingerprint

    Dive into the research topics of 'Technical Debt Problems and Concerns'. Together they form a unique fingerprint.

    Cite this