Enabling patterning of polymer optical devices working at visible wavelength using thermal nano-imprint lithography

Miguel Diez Garcia, Vincent Raimbault, Simon Joly, Laurent Oyhenart, Leire Bilbao, Chi Thanh Nguyen, Isabelle Ledoux-Rak, Laurent Bechou, Isabel Obieta, Corinne Dejous

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

1 Cita (Scopus)

Resumen

Thermal Ultraviolet NanoImprint Lithography is a fast and reliable process to manufacture large scale integrated polymer-based optical components from a soft stamp. This technology already provides polymer integrated components for optical communications operating in the infrared region. However, several fabrication issues must be addressed to enable reliable mass production of optical components working in the visible region, especially when patterning large devices with nanometric features. In this work, we report our fabrication results on grating coupler and optical microring resonators with SU-8 resist. The device is conceived for monomode visible wavelength operation dedicated to future optical sensing applications. For this purpose, sub-micron waveguides are needed. We reported two main defects on soft stamp fabrication: Partial sidewall detachment and shifted or double embossing of the features. Nanoimprinting SU-8 waveguides was achieved with the operational devices of the soft stamp.

Idioma originalInglés
Título de la publicación alojadaSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017
EditoresBenoit Charlot, Pascal Nouet, Claude Pellet, Yoshio Mita, Francis Pressecq, Peter Schneider, Stewart Smith
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9781538629529
DOI
EstadoPublicada - 18 jul 2017
Evento19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 - Bordeaux, Francia
Duración: 29 may 20171 jun 2017

Serie de la publicación

NombreSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017

Conferencia

Conferencia19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017
País/TerritorioFrancia
CiudadBordeaux
Período29/05/171/06/17

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