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FEM-Assisted Design and Characterization of a New Lithium Battery Pack-Heatsink Assembly

  • Nicola Delmonte
  • , Danilo Santoro
  • , Davide Spaggiari
  • , Filippo Gerbino
  • , Paolo Cova
  • , Ane Sainz De La Maza
  • , Edorta Ibarra
  • , Elena Trancho
  • , Roberto Menozzi
  • University of Parma
  • Basque Research and Technology Alliance (BRTA)

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

This work focuses on the design - driven by thermal simulations based on the finite element method (FEM) - and characterization of an assembly for temperature regulation of lithium battery packs. In this study we aim at developing a solution to achieve uniform temperature control over the cells of the battery pack. To this end, we included an aluminum plate featuring pins that thermally connect the battery pack to heat exchangers. To set the desired cell temperature, we considered thermal management systems with either air- or liquid-cooled heatsinks. Our findings indicate that a traditional serpentine liquid heatsink is particularly effective. Within the module, the heat transfer relies mainly on the aluminum plate and pins, which are designed to minimize the thermal resistance towards the heatsinks and to provide large thermal capacitance. This paper shows the main details of the FEM model, together with some validation results obtained using a dedicated test bench.

Idioma originalInglés
Título de la publicación alojada31st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2025 - Proceedings
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9798331594862
DOI
EstadoPublicada - 2025
Evento31st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2025 - Naples, Italia
Duración: 24 sept 202526 sept 2025

Serie de la publicación

Nombre31st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2025 - Proceedings

Conferencia

Conferencia31st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2025
País/TerritorioItalia
CiudadNaples
Período24/09/2526/09/25

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