Resumen
The additive manufacturing of CM247LC nickel-based superalloy, has a high development potential for applications where high temperature resistance and geometrically complex parts are required. In order to avoid the hot cracking response related to laser beam manufacturing technologies, Binder Jetting (BJ) is explored for processing the material. For this research study, a non-commercial powder was specifically produced by gas atomization and the characteristics of the different batches analysed. As a means for increasing the density of the samples printed by BJ, different sintering conditions were studied, and hot isostatic pressure was applied after sintering to fully consolidate the material. An exhaustive microstructural characterization was carried out in each step of the route that covers the entire process chain, from the production of the powder to the post processing operations. Therefore, this study sheds some light on the microstructural evolution towards the manufacturing of fully dense CM247LC parts by Binder Jetting.
| Idioma original | Inglés |
|---|---|
| Título de la publicación alojada | Proceedings - Euro PM2020 Congress and Exhibition |
| Editorial | European Powder Metallurgy Association (EPMA) |
| ISBN (versión digital) | 9781899072514 |
| Estado | Publicada - 2020 |
| Evento | European Powder Metallurgy Congress and Exhibition, Euro PM 2020 - Virtual, Online Duración: 5 oct 2020 → 7 oct 2020 |
Serie de la publicación
| Nombre | Proceedings - Euro PM2020 Congress and Exhibition |
|---|
Conferencia
| Conferencia | European Powder Metallurgy Congress and Exhibition, Euro PM 2020 |
|---|---|
| Ciudad | Virtual, Online |
| Período | 5/10/20 → 7/10/20 |
ODS de las Naciones Unidas
Este resultado contribuye a los siguientes Objetivos de Desarrollo Sostenible
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ODS 9: Industria, innovación e infraestructura
Huella
Profundice en los temas de investigación de 'Fully dense CM247LC alloy obtained by Binder Jetting. Characterization of the processing route'. En conjunto forman una huella única.Citar esto
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