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Generative AI for Reengineering Variants into Software Product Lines: An Experience Report

  • Mathieu Acher
  • , Jabier Martinez

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

17 Citas (Scopus)

Resumen

The migration and reengineering of existing variants into a software product line (SPL) is an error-prone and time-consuming activity. Many extractive approaches have been proposed, spanning different activities from feature identification and naming to the synthesis of reusable artefacts. In this paper, we explore how large language model (LLM)-based assistants can support domain analysts and developers. We revisit four illustrative cases of the literature where the challenge is to migrate variants written in different formalism (UML class diagrams, Java, GraphML, statecharts). We systematically report on our experience with ChatGPT-4, describing our strategy to prompt LLMs and documenting positive aspects but also failures. We compare the use of LLMs with state-of-the-art approach, BUT4Reuse. While LLMs offer potential in assisting domain analysts and developers in transitioning software variants into SPLs, their intrinsic stochastic nature and restricted ability to manage large variants or complex structures necessitate a semiautomatic approach, complete with careful review, to counteract inaccuracies.

Idioma originalInglés
Título de la publicación alojada27th ACM International Systems and Software Product Line Conference, SPLC 2023 - Proceedings
EditoresPaolo Arcaini, Maurice H. ter Beek, Gilles Perrouin, Iris Reinhartz-Berger, Ivan Machado, Silvia Regina Vergilio, Rick Rabiser, Tao Yue, Xavier Devroey, Monica Pinto, Hironori Washizaki
EditorialAssociation for Computing Machinery
Páginas57-66
Número de páginas10
ISBN (versión digital)9798400700927
DOI
EstadoPublicada - 28 ago 2023
Evento27th ACM International Systems and Software Product Line Conference, SPLC 2023 - Tokyo, Japón
Duración: 28 ago 20231 sept 2023

Serie de la publicación

NombreACM International Conference Proceeding Series
VolumenB-2

Conferencia

Conferencia27th ACM International Systems and Software Product Line Conference, SPLC 2023
País/TerritorioJapón
CiudadTokyo
Período28/08/231/09/23

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