Physical and mechanical behavior of tetraglycidyl diaminodiphenyl methane (TGDDM)/m‐phenylene diamine (m‐PDA) epoxy systems

The rheological behavior of a tetraglycidyl diaminodiphenyl methane with a tetrafunctional aromatic diamine has been studied in terms of the influence of curing agent content and temperature. In this work, critical times corresponding to gelation are used as a measure of activation energy. The dynamic mechanical behavior has been used to analyze the curing extent of these epoxy systems with different amine contents before and after thermal posttreatment. The β‐relaxation peak temperature is found to increase with the curing agent content and also after thermal posttreatment. This has been related to the rise of crosslinking extent. Dependence of flexural mechanical properties on curing agent content and the postcure process has also been determined.