Technical Debt Problems and Concerns

Jeffrey C. Carver; Xabier Larrucea; Alexander Serebrenik; Miroslaw Staron

doi:10.1109/MS.2021.3133734

Technical Debt Problems and Concerns

Jeffrey C. Carver, Xabier Larrucea, Alexander Serebrenik, Miroslaw Staron

Tecnalia Research & Innovation

Producción científica: Contribución a una revista › Artículo › revisión exhaustiva

Resumen

This article reports papers about technical debt (TD) from the 2021 IEEE/Association for Computing Machinery (ACM) International Conference on technical debt (TechDebt'21), the 43rd IEEE/ACM International Conference on Software Engineering: Journal First Track (ICSE-JF'21), the 43rd IEEE/ACM International Conference on Software Engineering: Software Engineering in Practice Track (ICSE-SEIP'21), and the 2021 IEEE/ACM 18th International Conference on Mining Software Repositories (MSR'21). Feedback or suggestions are welcome. In addition, if you try or adopt any of the practices included in the column, please send us and the authors a note about your experiences.

Idioma original	Inglés
Páginas (desde-hasta)	116-119
Número de páginas	4
Publicación	IEEE Software
Volumen	39
N.º	3
DOI	https://doi.org/10.1109/MS.2021.3133734
Estado	Publicada - 2022

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Technical Debt Problems and Concerns

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