Resumen
Development of haptic interfaces to enrich augmented and virtual reality with the sense of touch is the next frontier for technological advancement of these systems. Among available technologies, electrotactile stimulation enables design of high-density interfaces that can provide natural-like sensation of touch in interaction with virtual objects. The present study investigates the human perception of electrotactile sensations on fingertips, focusing on the sensation localization in function of the size and position of reference electrode. Ten healthy subjects participated in the study, with the task to mark the sensations elicited by stimulating the index fingertip using an 8-pad electrode. The test systematically explored several configurations of the active (position) and reference (position and size) electrode pads. The results indicated that there was a spreading of perceived sensations across the fingertip, but that they were mostly localized below the active pad. The position and size of the reference electrode were shown to affect the location of the perceived sensations, which can potentially be exploited as an additional parameter to modulate the feedback. The present study demonstrates that the fingertip is a promising target for the delivery of high-resolution feedback.
Idioma original | Inglés |
---|---|
Páginas (desde-hasta) | 255-266 |
Número de páginas | 12 |
Publicación | IEEE Transactions on Haptics |
Volumen | 15 |
N.º | 2 |
DOI | |
Estado | Publicada - 2022 |
Palabras clave
- Human-Computer Interaction
- Perception and Psychophysics
- Tactile Display
- Virtual Reality
Project and Funding Information
- Project ID
- info:eu-repo/grantAgreement/EC/H2020/856718/EU/TACTIle feedback enriched virtual interaction through virtual realITY and beyond/TACTILITY
- Funding Info
- The work in this study was performed within the TACTILITY project, which has received funding by European Union’s Horizon 2020 framework programme for research and innovation H2020-ICT-2018-2020/H2020-ICT 2018-3 under grant agreement no. 856718