Welcome message

Thorsten Berger; Paulo Borba; Gul Calikli; Goetz Botterweck; Tomi Männistö; Sarah Nadi; Timo Kehrer; David Benavides; Jabier Martinez; Christoph Seidl; Jianmei Guo; Philippe Collet; Julia Rubin; Oscar Diaz; Rick Rabiser; Christoph Elsner; Rafael Capilla; Natsuko Noda; Jesper Andersson; Mohammad Reza Mousavi; Andreas Wortmann; Sandro Schulze; Yingfei Xiong; Rodrigo Bonifacio; Truong Ho-Quang; Rebekka Wohlrab; Mukelabai Mukelabai; Tomislava Andric; Jan Bosch; Dan Hao

Welcome message

Thorsten Berger
, Paulo Borba
, Gul Calikli
, Goetz Botterweck
, Tomi Männistö
, Sarah Nadi
, Timo Kehrer
, David Benavides
, Jabier Martinez
, Christoph Seidl
, Jianmei Guo
, Philippe Collet
, Julia Rubin
, Oscar Diaz
, Rick Rabiser
, Christoph Elsner
, Rafael Capilla
, Natsuko Noda
, Jesper Andersson
, Mohammad Reza Mousavi

Andreas Wortmann, Sandro Schulze, Yingfei Xiong, Rodrigo Bonifacio, Truong Ho-Quang, Rebekka Wohlrab, Mukelabai Mukelabai, Tomislava Andric, Jan Bosch, Dan Hao

TECNALIA Research & Innovation

Producción científica: Contribución a una revista › Editorial

Idioma original	Inglés
Páginas (desde-hasta)	x
Publicación	ACM International Conference Proceeding Series
Volumen	1
Estado	Publicada - 20 ago 2018
Evento	22nd International Systems and Software Product Line Conference, SPLC 2018 - Gothenburg, Suecia Duración: 10 sept 2018 → 14 sept 2018

Otros archivos y enlaces

Enlace a la publicación en Scopus

Citar esto

@article{3b156329c526409ba9ef812f2da9e3c2,

title = "Welcome message",

author = "Thorsten Berger and Paulo Borba and Gul Calikli and Goetz Botterweck and Tomi M{\"a}nnist{\"o} and Sarah Nadi and Timo Kehrer and David Benavides and Jabier Martinez and Christoph Seidl and Jianmei Guo and Philippe Collet and Julia Rubin and Oscar Diaz and Rick Rabiser and Christoph Elsner and Rafael Capilla and Natsuko Noda and Jesper Andersson and Mousavi, \{Mohammad Reza\} and Andreas Wortmann and Sandro Schulze and Yingfei Xiong and Rodrigo Bonifacio and Truong Ho-Quang and Rebekka Wohlrab and Mukelabai Mukelabai and Tomislava Andric and Jan Bosch and Dan Hao",

year = "2018",

month = aug,

day = "20",

language = "English",

volume = "1",

pages = "x",

journal = "ACM International Conference Proceeding Series",

note = "22nd International Systems and Software Product Line Conference, SPLC 2018 ; Conference date: 10-09-2018 Through 14-09-2018",

}

Berger, T, Borba, P, Calikli, G, Botterweck, G, Männistö, T, Nadi, S, Kehrer, T, Benavides, D, Martinez, J, Seidl, C, Guo, J, Collet, P, Rubin, J, Diaz, O, Rabiser, R, Elsner, C, Capilla, R, Noda, N, Andersson, J, Mousavi, MR, Wortmann, A, Schulze, S, Xiong, Y, Bonifacio, R, Ho-Quang, T, Wohlrab, R, Mukelabai, M, Andric, T, Bosch, J & Hao, D 2018, 'Welcome message', ACM International Conference Proceeding Series, vol. 1, pp. x.

TY - JOUR

T1 - Welcome message

AU - Berger, Thorsten

AU - Borba, Paulo

AU - Calikli, Gul

AU - Botterweck, Goetz

AU - Männistö, Tomi

AU - Nadi, Sarah

AU - Kehrer, Timo

AU - Benavides, David

AU - Martinez, Jabier

AU - Seidl, Christoph

AU - Guo, Jianmei

AU - Collet, Philippe

AU - Rubin, Julia

AU - Diaz, Oscar

AU - Rabiser, Rick

AU - Elsner, Christoph

AU - Capilla, Rafael

AU - Noda, Natsuko

AU - Andersson, Jesper

AU - Mousavi, Mohammad Reza

AU - Wortmann, Andreas

AU - Schulze, Sandro

AU - Xiong, Yingfei

AU - Bonifacio, Rodrigo

AU - Ho-Quang, Truong

AU - Wohlrab, Rebekka

AU - Mukelabai, Mukelabai

AU - Andric, Tomislava

AU - Bosch, Jan

AU - Hao, Dan

PY - 2018/8/20

Y1 - 2018/8/20

UR - https://www.scopus.com/pages/publications/85055498512

M3 - Editorial

AN - SCOPUS:85055498512

VL - 1

SP - x

JO - ACM International Conference Proceeding Series

JF - ACM International Conference Proceeding Series

T2 - 22nd International Systems and Software Product Line Conference, SPLC 2018

Y2 - 10 September 2018 through 14 September 2018

ER -